JEDEC JESD22-A106 PDF

JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. By downloading this file the individual agrees not to charge for or resell the resulting material. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement.

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JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.

JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. By downloading this file the individual agrees not to charge for or resell the resulting material.

Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. In single chamber cycling, the load is placed in a stationary chamber, and is heated or cooled by introducing hot or cold air into the chamber. In dual chamber cycling, the load is placed on a moving platform that shuttles between stationary chambers maintained at fixed temperatures. In triple chamber temperature cycling there are three chambers and the load is moved between them.

This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high and low temperature extremes. The thermocouple, or equivalent temperature measurement apparatus, attachment method used should ensure that the entire mass of the sample s is reaching the temperature extremes and the soak requirements. Load transfer applies to dual and triple chamber cycling.

Note: Ramp rate can be load dependent and should be verified for the load being tested. These Soak Modes are listed in Table 2. The soak mode selected is dependent on the failure mechanism of interest. Direct heat conduction to sample s shall be minimized. The capability of each chamber achieving the sample temperature requirements shall be verified across each chamber by one or both of the following methods: a Periodic calibration using instrumented parts and a maximum load, and continual monitoring during each test of such fixed tool thermocouple temperature measurement s as adequate to ensure run-to-run repeatability.

When special mounting is required, it shall be specified. The sample shall then be subjected to the specified temperature cycling test condition for the specified number of cycles e. Completion of the total number of cycles specified for the test may be interrupted for interim end-point testing, test chamber loading or unloading of device lots, electrical test of samples at specified intervals or as the result of power or equipment failure.

If the thermocouple is affixed to the sample body, the amount of glue or tape used shall be minimized to insure proper temperature measurements. Typical failure mechanisms include, but are not limited to, fatigue such as metal circuit fatigue and delamination. These include flip chip, ball grid array and stacked packages with solder interconnections. Cycle frequency and soak time is more significant for solder interconnections.

However, test conditions should meet the soak, cycles per hour and ramp rate recommendations for the failure mechanism being tested. These conditions must be documented as indicated in Section 7 f. During this soak time the specimen shall reach the required nominal temperature, either Ts max or Ts min.

Soak Modes with longer soak times than those shown in Table 2 are not compatible with standard cycle rates and should be selected only as required for a specific failure mechanism.

This equates to soak mode 2, see Table 2. Table 3 lists typical cycle rates for components versus test condition and soak mode.

For solder interconnections, cycle times less than 30 minutes are not recommended. Samples with large thermal mass and low heat transfer efficiency require ramp rates slow enough to compensate for the thermal mass.

The temperature of the sample should be within a few degrees of the ambient temperature during the temperature ramps. For samples of large thermal mass, use of a single zone chamber may be required to achieve the best ramp rate.

For samples without a thermal mass constraint, the ramp rate can be faster and dual chambers can be used. Typical test requirements for solder interconnection are listed in Table 4. The combination of ramp rate and soak time are important when testing solder interconnections.

Electrical test may be performed either in-situ or at an ambient or extreme temperature. Failure resistance criteria must be adjusted based on the temperature of the sample at time of test. In addition, hermeticity test s per Test Method A shall also be performed for hermetic devices. Parametric and functional limits shall be defined by the applicable procurement document. Mechanical damage shall not include damage induced by fixturing or handling or the damage is not critical to the package performance in the specific application.

Specify the number of cycles, temperature extremes, soak time, cycles per hour, tolerance on temperature extremes if different from Table 1 , ramp rate and interim measurements, if required. If the change to a concept involves any words added or deleted excluding deletion of accidentally repeated words , it is included. Some punctuation changes are not included. All comments will be collected and dispersed to the appropriate committee s. Suite Arlington, VA Fax: Recommendations for correction: 3.

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Vokora Thermal Shock Testing For Electronic Devices The number of cycles can vary from 1 to and its setting will depend on the type of device and its application. The total time the load is immersed in the bath. All comments will be collected and dispersed to the appropriate committee s. In both systems, the equipment must be able to vary the hot chamber temperature, cold chamber temperature, dwelling time or soak time of the hot chamber, jesda06 time of the jessda chamber, transition time from one chamber to the other chamber and setting of the number of cycles. Some punctuation changes are not included.

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JEDEC JESD22-A106 PDF

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